NSN 5961-00-780-8581 Parts of Semiconductor Devic
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Alternative NSN: 5961-00-780-8581 |
Item Name: Semiconductor Devic |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 007808581 |
NCB Code: USA (00) |
Manufacturers: Micro Uspd Inc , Rockwell Collins Inc , Semitronics Corp |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
2N1882S | micro uspd inc | semiconductor devic | Avl | RFQ |
353-3489-00 | rockwell collins inc | semiconductor devic | Avl | RFQ |
353-3489-00 | semitronics corp | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961007808581
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.200 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 0.500 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.290 INCHES MINIMUM AND 0.390 INCHES MAXIMUM |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
AXGY | MOUNTING METHOD | TERMINAL |
CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM BREAKOVER VOLTAGE, DC |
CTQX | CURRENT RATING PER CHARACTERISTIC | 20.00 AMPERES FORWARD CURRENT, AVERAGE ABSOLUTE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS CASE |
FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |
TEST | TEST DATA DOCUMENT | 13499-353-3489 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
AYQS | TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
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