NSN 5961-01-122-9171 Parts of Semiconductor Devic
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| Alternative NSN: 5961-01-122-9171 |
| Item Name: Semiconductor Devic |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 011229171 |
| NCB Code: USA (01) |
| Manufacturers: Avago Technologies Us Inc , Fei Microwave Inc , Hewlett Packard Inc , Macom , Raytheon Company |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 805563-1 | raytheon company | semiconductor devic | Avl | RFQ |
| A2X1621 | macom | semiconductor devic | Avl | RFQ |
| TX-2080 | hewlett packard inc | semiconductor devic | Avl | RFQ |
| 5082-2835 | hewlett packard inc | semiconductor devic | Avl | RFQ |
| QSCH-1678 | hewlett packard inc | semiconductor devic | Avl | RFQ |
| A2XA1621 | fei microwave inc | semiconductor devic | Avl | RFQ |
| QSCH-1678 | avago technologies us inc | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961011229171
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.068 INCHES MINIMUM AND 0.076 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTRD | POWER RATING PER CHARACTERISTIC | 150.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| TEST | TEST DATA DOCUMENT | 96906-MIS-STD-202 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). AND 96906-MIL-STD-750 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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